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low - power, high - resolution 16 - bit sensor signal conditioner zssc3036 datasheet ? 2016 integrated device technology, inc. 1 april 20, 2016 brief description the zssc 3036 is a sensor signal conditioner (ssc) integrated circuit for high - accuracy amplification and analog - to - digital conversio n of a differ ential input signal. designed for high - resolution altimeter module applications, the zssc 3036 can perform offset, span, and 1 st and 2 nd order temperature compen - sation of the measured signal. developed for correc - tion of resistive bridge sensors, it can also pro vide a corrected temperature output measured with an internal sensor. the measured and corrected bridge values are provided at the digital output pins, which can be configured as i 2 c ? * ( 3.4mhz) or spi ( 20mhz). digital compensation of signal offset, sen sitivity, temperature, and non - linearity is accomplished via an 18 - bit internal digital signal processor (dsp) run - ning a correction algorithm. calibration coeffici ents are stored on - chip in a highly reliable, non - volatile, multi ple - time programmable (mtp) mem ory. pro - gramming the zssc 3036 is simple via the serial interface. the ic - internal charge pump provides the mtp programming voltage. the interface is used for the pc - controlled cali bration procedure, which pro - grams the set of cali bration coefficients in memory. the zssc3036 provides accelerated signal process - ing in order to support high - speed control, safety , and real - time sensing applications . it complements idt ?s additional zssc30 x 6 products . features ? flexible, programmable analog front - end design; up to 16 - bit scalable, charge - balancing two - segment analog - to - digital converter (adc) ? fully programmable gain amplifier accepting sensors from 14 to 72 (linear factor) ? internal auto - compensated temperature se nsor ? digital compensation of individual sensor offset; 1 st and 2 nd order digital compensation of sensor gain as well as of 1 st and 2 nd order tem perature gain and offset drift ? fast sensing: 16- bit conditioned sensor signal measure ment rate at more than 200s -1 ? typical sensor elements can achieve accuracy of less than 0. 1 0% fso ** @ - 40 to 110 c benefits ? integrated 18 - bit calibration math dsp ? fully corrected signal at digital output ? layout customized for die - die bonding with sensor for high - density chip - on- board assembly ? single - pass calibration minimizes calibration costs ? no external trimming , filter , or buffering com - ponents required ? highly integrated cmos design ? excellent for low - voltage and low - power battery applications ? optimized for operation in calibrated resistive sensor modules physical characteristics ? supply voltage range: 1.8 to 3.6v ? current consumptio n : 1m a ( operating mode) ? sleep state current : 5 0n a ( typical ) ? temperature resolution: < 0.00 3 k /lsb ? oper ation temperatures: ? 40c to +85 c ? 40c to +11 0 c ? small die size ? delivery options: die for wafer bonding * i 2 c? is a trademark of nxp. ** fso = full scale output . zssc 3036 application example
low - power, high - resolution 16 - bit sensor signal conditioner zssc3036 datasheet ? 2016 integrated device technology, inc. 2 april 20, 2016 applications ? barometric altitude measurement for portable navigation or emergency call systems ? altitude measurement for car navigation ? inside hard disk pressure measurement ? weather forecast ? fan control ? industrial, pneumatic , and liquid pressure zssc3036 block diagram ordering information (see section 6 in the data sheet for additional options for delivery package and wafer thickness of 725m .) sales code description delivery package zssc3036cc1b die ?t emperature range: ? 40c to +85 c wafer (304m) unsawn, tested zssc3036ci1b die ? temperature range: ? 40c to +85 c, e xtended qualification wafer (304m) unsawn, tested zssc3036cc1c die ? temperature range: ? 40c to +85 c dice on frame (304 m) , tested zssc3036ci 1bh die ? temperature range: ? 40c to +110 c , e xtended qualification wafer (304m) unsawn, tested zssc3036ci 1ch die ? temperature range: ? 40c to +110 c , e xtended qualification dice on frame (304m), tested zssc30x6 - kit evaluation kit for zssc30x6 product family, including boards, cable, software, and 1 sample corporate headquarters 6024 silver creek valley road san jose, ca 95138 www.idt.com sales 1- 800- 345- 7015 or 408 - 284- 8200 fax: 408 - 284- 2775 www.idt.com/go/sales tech support www.idt.com/go/support disclaimer integrated device technology, inc. (idt) reserves the right to modify the products and/or specifications described herein at any time, without notice, at idt's sole discretion. performance specifications and operating parameters of the described products are determined in an independent state and are not guarante ed to perform the same way when installed in customer products. the informati on contained herein is provided without representation or warranty of any kind, whether express or implied, including, but no t limited to, the suitability of idt's products for any particular purpose, an implied warranty of merchantability, or non - infringe ment of the intellectual property rights of others. this document is presented only as a guide and does not convey any licens e under intellectual property rights of idt or any third parties. idt's products are not intended for use in applications involvin g extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an idt p roduct can be reasonably expected to significantly affect the health or safety of users. anyone using an idt product in such a mann er does so at their own risk, absent an express, written agreement by idt. integrated device technology, idt and the idt logo are trademarks or registered trademarks of idt and its subsidiaries in the united states and other countries. other trademarks us ed herein are the property of idt or their respective third party owners. for datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary . all contents of this document are copyrig ht of integrated device technology, inc. all rights reserved. sensor bridge agnd / cm generator bias current generator power-on reset temperature reference sensor 18-bit dsp core (calculations , communication ) mtp rom system control unit multiplexer pre- amplifier v tp v tn eoc inp inn vdd vssb ring oscillator clock generator sel spi i2c tm sclk/scl miso mosi/sda ss vss voltage regulator power ctr. vreg int a d 16 bit vddb zssc3036
zssc3036 datasheet ? 2016 integrated device technology, inc. 3 april 20, 2016 table of contents 1 ic characteristics .......................................................................................................................................... 6 1.1. absolute maximum ratings .................................................................................................................... 6 1.2. operating conditions .............................................................................................................................. 6 1.3. electrical parameters ............................................................................................................................. 7 1.4. power supply rejection ratio (rsrr) vs. frequency ........................................................................... 9 2 circuit description ....................................................................................................................................... 10 2.1. brief description ................................................................................................................................... 10 2.2. signal flow and block diagram ............................................................................................................ 10 2.3. analog front end .................................................................................................................................. 11 2.3.1. amplifier ......................................................................................................................................... 11 2.3.2. analog - to - digital converter ............................................................................................................ 13 2.3.3. temperature measurement ........................................................................................................... 17 2.3.4. bridge supply ................................................................................................................................. 17 2.4. digital section ....................................................................................................................................... 17 2.4.1. digital signal processor (dsp) core ............................................................................................. 17 2.4.2. mtp memory .................................................................................................................................. 17 2.4.3. clock generator ............................................................................................................................. 18 2.4.4. power supervision ......................................................................................................................... 18 2.4.5. interface ......................................................................................................................................... 18 3 functional description ................................................................................................................................. 19 3.1. power up .............................................................................................................................................. 19 3.2. measureme nts ...................................................................................................................................... 19 3.3. operational modes ............................................................................................................................... 19 3.4. command interpretation ....................................................................................................................... 22 3.4.1. spi/i 2 c? commands .................................................................................................................... 22 3.5. communication interface ...................................................................................................................... 25 3.5.1. common functionality ................................................................................................................... 25 3.5.2. spi ................................................................................................................................................. 26 3.5.3. i 2 c? ............................................................................................................................................... 29 3.6. memory ................................................................................................................................................. 30 3.6.1. programming memory ................................................................................................................... 30 3.6.2. memory status commands ........................................................................................................... 31 3.6.3. memory contents ........................................................................................................................... 32 3.7. calibration sequence ........................................................................................................................... 38 3.7.1. calibration step 1 ? assigning unique identification ..................................................................... 39 3.7.2. calibration step 2 ? data collection .............................................................................................. 39 3.7.3. calibration step 3 ? coefficient calculations ................................................................................. 40 3.8. the calibration math ............................................................................................................................ 40 3.8.1. bridge signal compensation ......................................................................................................... 40 3.8.2. temperature signal compensation ............................................................................................... 43
zssc3036 datasheet ? 2016 integrated device technology, inc. 4 april 20, 2016 4 die pad assignments .................................................................................................................................. 44 5 quality and reliability .................................................................................................................................. 45 6 ordering sales codes ................................................................................................................................. 45 7 related documents ..................................................................................................................................... 45 8 glossary ...................................................................................................................................................... 46 9 document revisio n history ......................................................................................................................... 48 table of figures figure 2.1 zssc3036 functional block diagram ........................................................................................... 10 figure 2.2 adc offset ..................................................................................................................................... 16 figure 3.1 operational flow chart: power up ................................................................................................ 21 figure 3.2 operational flow chart: command mode and normal mode ....................................................... 22 figure 3.3 spi configuration cpha=0 ........................................................................................................... 26 figure 3.4 spi configuration cpha=1 ........................................................................................................... 27 figure 3.5 spi command request ................................................................................................................. 27 figure 3.6 spi read status ............................................................................................................................ 28 figure 3.7 spi read data ............................................................................................................................... 28 figure 3.8 i 2 c? command request .............................................................................................................. 29 figure 3.9 i 2 c? read status .......................................................................................................................... 29 figure 3.10 i 2 c? read data ............................................................................................................................ 30 fi gure 3.11 memory program operation .......................................................................................................... 31 figure 4.1 zssc3036 pad assignments ........................................................................................................ 44 list of tables table 1.1 maximum ratings ............................................................................................................................ 6 table 1.2 operating conditions ....................................................................................................................... 6 table 1.3 requirements for vdd power - on reset .......................................................................................... 7 table 1.4 electrical parameters ....................................................................................................................... 7 table 2.1 amplifier gain: stage 1 .................................................................................................................. 11 table 2.2 amplifier gain: stage 2 .................................................................................................................. 12 table 2.3 gain polarity .................................................................................................................................. 12 table 2.4 msb/lsb segmentation settings for bridge measurement .......................................................... 13 table 2.5 msb/lsb segmentation settings for temperature measurement ................................................ 13 table 2.6 adc conversion times for a single a2d conversion ................................................................... 14 table 2.7 typical conversion times vs. noise performance for 16 - bit results with full sensor signal conditioning for azbm, bm, aztm, and tm ................................................................................. 15 table 2.8 adc offset settings ....................................................................................................................... 16 table 3.1 spi/i 2 c? commands .................................................................................................................... 23 table 3.2 get_raw commands .................................................................................................................... 24 table 3.3 general status byte ....................................................................................................................... 25
zssc3036 datasheet ? 2016 integrated device technology, inc. 5 april 20, 2016 table 3.4 status byte for read operations ................................................................................................... 25 table 3.5 status byte for write operations ................................................................................................... 25 table 3.6 mode status ................................................................................................................................... 26 table 3.7 memory status word ..................................................................................................................... 31 table 3.8 mtp memory content assignments .............................................................................................. 32 table 4.2 pad assignments ........................................................................................................................... 44
zssc3036 datasheet ? 2016 integrated device technology, inc. 6 april 20, 2016 1 ic characteristics 1.1. absolute maximum ratings note: the absolute maximum ratings are stress ratings only. the zssc3036 might not function or be operable above the recommended operating cond itions. stresses exceeding the absolute maximum ratings might also damage the device. in addition, extended exposure to stresses above the recommended operating conditions might affect device reliability. idt does not recommend designing to the ?absolute maximum ratings.? table 1 . 1 maximum ratings parameter symbol min typ max units voltage reference vss 0 0 v analog supply voltage v dd -0. 4 3.63 v voltage at all a nalog and d igital io pins v a_io , v d_io -0. 5 v dd +0. 5 v input c urrent into any p in e xcept sda, clk 1) and s upply p ins 2) i in -100 100 ma electrostatic d ischarge tolerance ? human bod y model (hbm1) 3) v hbm 1 4 000 - v storage t emperature t stor -50 125 c 1) latch - up current limit for clk/sclk and mosi/sda : 70ma . 2) latch - up resistance; reference for pin is 0v. 3) hbm1: c = 100pf charged to v hbm1 with resistor r = 1.5k ? in series based on mil 883, method 3015.7. esd protection referring to the human body model is tested with devices in ceramic dual in - line packages (cdip) during product qualification. 1.2. operating conditions the r eference for all voltages is vss. table 1 . 2 operating conditions parameter symbol min typ max unit s upply v oltage v dd 1.8 - 3.6 v vdd rise time t vdd 200 s bridge current 1) i vddb 1.8 m a 16.5 operation temperature range ? standard t amb -40 - 85 c operation temperature range -- extended 2) -40 - 110 c e xternal capacitance between vddb and vss cl 0.01 50 nf 1) p ower supply rejection is reduced if a current in the range of 16.5ma > i vddb > 1.8ma is drawn out of vddb. 2) extended temperature range is indicated by the addition of h to the part number.
zssc3036 datasheet ? 2016 integrated device technology, inc. 7 april 20, 2016 a dynamic power - on - reset circuit is implemented in order to achieve minimum current consumption in idle mode . the vdd low level and the subsequent rise time and vdd rising slope must meet the requirements in table 1 . 1 to guarantee an overall ic reset ; lower v dd low levels allow slower rising of the subsequent on - ramp of vdd. other combinations m ight also be possible. for example, t he reset trigger can be inf luenced by increasing the power - down time and lowering the vdd rising slope requirement. table 1 . 3 requirements for vdd power - on reset parameter symbol min typ max unit power down time (duration of vdd low level) t spike 3 - - s vdd low level vdd low 0 - 0.2 v vdd rising slope sr vdd 10 - - v/ms 1.3. electrical parameters all parameter values are valid only under the specified operating conditions. all v oltages are referenced to vss. table 1 . 4 electrical parameters note: see important table notes at the end of the table. parameter symbol conditions/comments min typ max unit supply b ridge s upply v oltage, adc r eference v oltage v ddb i nternally generated 1.6 0 1. 67 1.7 4 v current consumption i vdd active state, average 900 1500 a sleep state, idle current , 85c 20 250 n a sleep state, idle current , 1 10 c 50 9 5 0 na power supply rejection 20 log 10 (v dd /v ddb ) (see section 1.4 ) psr vdd v dd = 1.8v 17 db v dd = 2v 3 2 db m emory p rogram v oltage v dd,prog required voltage level at vdd pin 2.9 3.6 v mean p rogram c urrent i vdd, p rog mean current consumption during mtp programming cycle at vdd 6 ma peak program current i prog, max mtp p rogram ming at vdd pin , dynamic switch - on current draw 20 ma
zssc3036 datasheet ? 2016 integrated device technology, inc. 8 april 20, 2016 parameter symbol conditions/comments min typ max unit analog -to - digital converter (adc , a2d ) resolution r adc 10 16 bit adc c lock f requency f adc internal adc clock 1. 3 1.5 1 . 7 mhz r eference v oltage n v refn v ddb * 0.03 r eference v oltage p v refp v ddb * 0.97 o ffset a2d_offset 8 - step programmable offset 1/16 8/16 integral nonlinearity (inl) inl adc b ased on ideal slope -4 - +4 lsb differential nonlinearity dnl adc t ested / verified within design -1 - +1 lsb conversion rate, 16 -b it s ingle f s ,raw conversion s per second for single 16- bit a2d conversion 15 - 1 015 hz amplifier gain g amp 32 steps 13.2 72 gain error g err referenced to nominal gain - 1.5 - 1.5 % sensor signal conditioning performance ic accuracy error 1) err a,ic accuracy error for ideally linear (in temperature and measurand ) sensor 0. 0 1 % fso conversion rate, 16 -b it ssc f s, ssc conversion per second for fully corrected 16 - bit measurement 3.7 245 hz input input voltage range v inp , v inn input voltage range at inp and inn 0.65 1.05 v bridge resistance r br f ull power supply disturbance rejection ( psrr ) capabilities 1 10 50 k r educed psrr, but full functionality 100 999 power -up start - up time t sta1 v dd ramp up to interface communication (see section 3.1 ) 1 .3 ms t sta2 v dd ramp up to analog operation 3.3 ms wake - up time t wup1 sleep to active state interface communication 0. 7 ms t wup2 sleep to active state analog operation 2 .7 ms
zssc3036 datasheet ? 2016 integrated device technology, inc. 9 april 20, 2016 parameter symbol conditions/comments min typ max unit oscillator internal oscillator frequency f clk 2 . 6 3 3 . 4 mhz internal temperature sensor temperature resolution f or both temperature range s : - 40c to +85c - 40c to + 110 c 0.003 k/lsb interface and memory spi clock frequency f c,spi maximum capacitance at miso line: 40pf @ v dd =1.8v 20 mhz i2c ? clock frequency f c,i2c 3.4 mhz program time t prog mtp programming time per 16 - bit register 500 600 s data retention 2) t ret_mtp 1000h @ 1 25 c 10 a 1) percentage referred to maximum full - scale output (fso); e.g. for 16 - bit measurements: err a,ic [%fso] = 100 max{ | adc meas ? adc ideal | } / 2 16 . 2) with maximum ambient temperature of 125c. 1.4. power supply rejection ratio (rsrr) vs. frequency
zssc3036 datasheet ? 2016 integrated device technology, inc. 10 april 20, 2016 2 c ircuit description 2.1. brief description the zssc 3036 provides a highly accurate amplification of bridge sensor signals. the compensation of sensor offset, sensitivity, temperature drift, and non - linearity is accomplished via an 18 - bit dsp core running a correction algorithm with calibration coefficients stored in an mtp memory. the zssc 3036 can be configured for a wide range of resistive bridge sensor types. a digital in terface (spi or i 2 c ? ) enables communication. the zssc 3036 supports two operational modes: no rmal m ode and c om mand m ode. normal m ode is the standard operating mode. typically in normal mode, the zssc3036 wakes up from a s leep s tate (low power) , runs a measurement in a ctive s tate , and automatically returns to the sleep s tate . (see section 3.3 for details on operational modes.) 2.2. signal flow and bloc k diagram see figure 2 . 1 for the zssc 3036 block diagram. the sensor bridge supply v ddb and the power supply for analog circuitry are provided by a voltage regulator , which is optimized for power supply disturbance rejection (psrr). see section 1.4 for a graph of psrr versus frequency. to improve noise suppression, the digital blocks are powered by a separate voltage regulator. a power supervision circuit monitors all supply voltage s and generates appropriate reset signals for initiali zing the digital blocks. the state machine controls the analog circuitry to perform the three measurement types: bridge, temperature, and offset measurement. the multiplexer selects the signal input to the amplifier, which can be the external signals from the input pins inp and inn , the internal temperature reference sensor signals, or an input short for measuring offset. a full measurement request will trigger a n automatic sequence of all measurement types and all input signals. the temperature reference s ensor block is based on a resistive sens ing element . figure 2 . 1 zssc 3036 functional block diagram sensor bridge agnd / cm generator bias current generator power - on reset temperature reference sensor 18 - bit dsp core ( calculations , communication ) mtp rom system control unit multiplexer pre - amplifier v tp v tn eoc inp inn vdd vssb ring oscillator clock generator sel spi i 2 c tm sclk / scl miso mosi / sda ss vss voltage regulator power ctr . vreg int a d 16 bit vddb zssc 3036
zssc3036 datasheet ? 2016 integrated device technology, inc. 11 april 20, 2016 the amplifier consists of two stages with programmable gain values. the 1/f noise and inherent offset are suppressed by auto - zero and chopper stabilizer techniques. th is auto - zero sequence is performed before each bridge sensor and temperature measurement to compensate for the inherent offset of the amplifier. the zssc 3036 em ploys a 2 - stage analog - to - digital converter (adc) based on switched - capacitor technique with inherit low - pass behavior and noise suppression. the programmable resolution from 10 to 16 bit s provides flexibility for adapting the conversion characteristics. t o improve power supply noise suppression, the adc uses the bridge supply v ddb as its reference voltage. the remaining ic - internal offset and the sensor element offset , i.e., the overall system offset for the amplifier and adc , can be canceled by an offset and auto - zero measurement , respectively . the dsp accomplishes the auto - zero , span, and 1 st and 2 nd order temperature compensation of the measured bridge signal. the correction coefficients are stored in the mtp memory. the zssc 3036 supports spi and i 2 c ? i nterface communication for controlling the zssc3036 , configuration , and measurement result output. 2.3. analog front end 2.3.1. amplifier the amplifier has a differential architecture and consists of two stages . the amplification of each stage and the sensor bridge ga in polarity are programmable via settings in the meas urement configuration register bm_config (address 10 hex ; see section 3.6.3 ) in the mtp memory (see section 2.4.2 ). the first five bits of bm_config are the p rogrammable gain setting s gain_stage1 and gain_stage2 . the options for the programmable gain settings are listed in table 2 . 1 and table 2 . 2 . table 2 . 1 amplifier gai n: stage 1 gain_stage1 bm_config bit g1 bm_config bit g0 stage 1 gain setting 0 0 12 0 1 20 1 0 30 1 1 40
zssc3036 datasheet ? 2016 integrated device technology, inc. 12 april 20, 2016 table 2 . 2 amplifier gain: stage 2 gain_stage2 bm_config bit g4 bm_config bit g3 bm_config bit g2 stage 2 gain setting 0 0 0 1.1 0 0 1 1.2 0 1 0 1.3 0 1 1 1.4 1 0 0 1.5 1 0 1 1.6 1 1 0 1.7 1 1 1 1.8 if needed, the polarity of the sensor bridge gain can be reversed by setting the gain_ p olarity bit , which is bit 5 in the bm_config register ( s ee section 3.6.3 ) . changing the gain polarity is achieved by inverting the chopper clock. table 2 . 3 gives the settings for the gain_ p olarity bit. this feature enables applying a sensor to the zssc 3036 with swapped input signals at inn and inp ; e.g., to avoid crossing wires for the final sensor modu le?s assembly. table 2 . 3 gain polarity gain_ p olarity ( bm_config bit 5) gain setting d escription 0 +1 no polarity change . 1 -1 gain polarity is inverted . the inher en t amplifier offset is suppressed by means of auto - zero and chopper techniques. the optimal gain (and offset) setup for a specific sensor element can be determined by these steps : 1) collect sensor elements? characteristic, statistical data (over temperature, ambient sensor parameter , and over production tolerances) : a. minimum differential output voltage: v min b. maximum differential output voltage: v max note : the best possible setup can only be determined if the absolute value of v max is bigger than the absolute value of v min . if this is not the cas e, the gain polarity should be reversed . 2) if v min and v max have different signs (normally: v max is positive and v min is negative), then the required adc offset shift can be selected using th is ratio: ratio offset = | v min | / (v max ? v min ) . in this case , the respective offset setup (a2d_offset) is the nearest integer of multiples of 1/16 in the range of 1/16 to 8/16 ( see table 2 . 8 ) : a2d_offset = round_to_x16 th { ratio offset } .
zssc3036 datasheet ? 2016 integrated device technology, inc. 13 april 20, 2016 3) determine which of the two following cases is valid. a. if ratio offset ? a2d_offset 0 then c alculate t heoretical optimum gain: gain opt = (1 ? a2d_offset) * v ref / v max b. if ratio offset ? a2d_offset > 0 then calculate t heoretical optimum gain: gain opt = a2d_offset * v ref / | v min | with: v ref = v refp ? v refn = 0.94v ddb , min 1.5v finally, s elect the setup gain ( gain setup ) as the nearest gain to gain opt , where gain setup gain opt . 2.3.2. analog - to - digital converter a second - order charge - balancing analog - to - digital converter (adc) is used to convert the amplifier signal. to allow optimizing the trade - off between conversion time and resolut ion , the conversion is split into a msb coarse conversion and an lsb fine conversion. the final adc resolution is determined by msb + lsb. for the bridge measurement, t he msb - lsb segmentation is programmable via the msb and lsb settings in the bm_config register (10 hex ; s ee section 3.6.3 ) stored in the mtp memory (see section 2.4.2 ) . for the temperature measurement, the msb - lsb segmentation is programmable via the temp_adc settings in the bm_config register. the conversion time is proportional to 2 msb +2 lsb . during the msb coarse conversion , the adc input signal is sampled and integrated 2 msb times , resulting in inherit low - pass behavior and noise suppression . t he longer the msb coarse conversion is , the better the noise suppression is . possible settings are listed below in table 2 . 4 and table 2 . 5 . table 2 . 4 msb/lsb segmentation settings for bridge measure ment msb setup bits [7:6] in bm_config number of msb coarse conversion bits lsb setup bits [9:8] in bm_config number of lsb fine conversion bits 00 bin 10 00 bin 0 01 bin 12 01 bin 2 10 bin 14 10 bin 4 11 bin 16 11 bin 6 table 2 . 5 msb/lsb segmentation settings for temperature measurement temp_adc setup bits [14:13] in bm_config number of msb coarse conversion bits number of lsb fine conversion bits 00 bin s etup according to idt configuration in reserved memory ( recommended setup for best performance and speed trade- off) 01 bin 16 0 10 bin 10 6 11 bin 12 4
zssc3036 datasheet ? 2016 integrated device technology, inc. 14 april 20, 2016 useful msb/lsb setups are with lsb = 0 (msb - only conversions) or combinations that result in msb + lsb 1 6 . resolutions beyond 16 - bit mainly digitize the collected front - end noise and typically do not improve the system performance. the adc conversion times for different msb/lsb settings are listed in table 2 . 6 . table 2 . 6 adc conversio n times for a s ingle a2d c onversion msb [bit s ] lsb [bit s ] bridge or temperature measurement conversion time in s (typical) 10 0 785 12 0 3200 14 0 12660 16 0 49470 10 2 830 12 2 3240 14 2 12710 10 4 870 12 4 3280 10 6 940 table 2 . 7 shows the trade - off between noise performance and typical conversion time for 1 6 - bit result s for a signal that has been fully conditioned usi ng 4 single measurements : the auto - zero bridge measurement (azbm) , the bridge measurement (bm), auto - zero temperature measurement (aztm), and temperature measurement ( tm ).
zssc3036 datasheet ? 2016 integrated device technology, inc. 15 april 20, 2016 table 2 . 7 typical conversion times vs. noise performance for 16 - b it results with full sensor signal conditioning for azbm, bm, aztm, and tm note: the pink shading indicates idt ?s recommended adc segmentation for temperature sensor measurement . adc segmentation: temperature sensor [msb/ lsb] adc segmentation: bridge sensor [msb/lsb] ty pical measurement duration, measure , (ac hex ) [ms] typ ical 3 - s igma noise for ssc -c orrected output 1) [counts] 10 / 6 10 / 6 4.7 11.0 10 / 6 12 / 4 10.5 7.2 10 / 6 14 / 2 34.3 5.7 10 / 6 16 / 0 129.5 5.6 12 / 4 10 / 6 10.5 10.3 12 / 4 12 / 4 15.9 6. 9 12 / 4 14 / 2 39.2 5. 5 12 / 4 16 / 0 136.5 5. 2 16 / 0 10 / 6 129.5 9.7 16 / 0 12 / 4 136.5 6.5 16 / 0 14 / 2 160.7 5. 3 16 / 0 16 / 0 258.9 4.8 1) reference noise values obtained with this setup: 13.7k ? se nsor bridge, 25c, gain=64, adc shift= - 1/16 through 15/16 (see below) , vdd=1.8v. the adc offset is programmable in 8 steps so that the adc input voltage range can be adapted to the voltage range at the input pins inp and inn. possible adc input voltages are shown in figure 2 . 2 , where v agnd v ddb /2. the adc offset is controlled by the a2d_offset setting bits [12:10] in the measurement configuration register bm_config (10 hex ; see section 3.6.3 ) in the mtp memory (see section 2.4.2 ) . the adc offset settings are listed in table 2 . 8 . see section 1.4 for typical values for v refn and v refp .
zssc3036 datasheet ? 2016 integrated device technology, inc. 16 april 20, 2016 figure 2 . 2 adc offset table 2 . 8 adc offset settings z2 z1 z0 adc d ifferential i nput r ange/v ref where v ref = v refp - v refn a2d_offset 0 0 0 - 1/16 to 15/16 1/16 0 0 1 - 2/16 to 14/16 2/16 0 1 0 - 3/16 to 13/16 3/16 0 1 1 - 4/16 to 12/16 4/16 1 0 0 - 5/16 to 11/16 5/16 1 0 1 - 6/16 to 10/16 6/16 1 1 0 - 7/16 to 9/16 7/16 1 1 1 - 8/16 to 8/16 8/16 v refp v refn v in , v ip adc out 1 0 1/16 8/16 a2d_offset v inp , a2d_offset = 1/16 v inn , a2d_offset = 1/16 v inp , a2d_offset = 8/16 v inn , a2d_offset = 8/16 v agnd
zssc3036 datasheet ? 2016 integrated device technology, inc. 17 april 20, 2016 2.3.3. temperature measurement the zssc 3036 provides an internal temperature sensor measurement to allow compensation for temperature effects . see section 1.3 for the temperature sensor resolution . the temperature sensor uses bipolar transistors. any transistor circuitry mismatch is supp ressed by dynamic element matching technique. the temperature output signal is a differential voltage that is adapted by the amplifier for the adc input . for temperature measurements , the adc offset and amplifier gain setting are defined by idt . the a dc msb/lsb segmentation is programmable by the user for optimizing noise immunity or conversion time (see section 2.3.2 ) . 2.3.4. bridge supply the zssc 3036 provides dedicated bridge supply pins vddb and vssb. the adc reference voltages for the sensor bridge measurement are derived from the se internal voltages so th at bridge supply disturbances are suppressed. the current drive ability of v ddb is limited (see i vddb in section 1.2 ). 2.4. digital section 2.4.1. digital signa l processor (dsp) core the dsp core block performs the algorithm for correcting the sensor signal. the resulting coefficients are stored in the mtp memory. when the measurement results are available , the "end of conversion" signal is set at the eoc pin . the internal eoc information is valid only if both the measurement and calculation have been completed. 2.4.2. mtp memory the zssc 3036 ?s memory is designed with an otp (one - time programmable) structure. the memory is organized in 4 one - time programmable pages. w hen data in the currently valid memory page needs to be updated, normally a new page must be selected by increasing the page counter and the whole memory content must be written in its updated version. the user has access to a 24 x 16 bit storage area for values such as calibration coefficients . dedicated calibration values are stored in an area not accessible to the user . the required programming voltage is generated internally in the zssc3036 whereas increased zssc3036 power supply requirements must be fu lfilled during programming (see memory programming voltage in section 1.3 ) . there is no over - write or erase function for the mtp memory. the physical memory function is such that each single bit that has not yet been set to 1 ( i.e., remains 0) can still be changed to 1, so it is possible to (partially) re - program an mtp register as shown in the following example: ? assume mtp address 11 hex was written with 8421 hex which is 1000 0100 0010 0001 bin . ? changing the register content s to a6a7 hex (i.e., 1010 0110 1010 0111 bina ry ) can be achieved by either writing a6a7 hex (any already written bit will be ignored automatically) or just writing the difference compared to 8421 hex , which is 2286 hex .
zssc3036 datasheet ? 2016 integrated device technology, inc. 18 april 20, 2016 the content of a re - written register can generally be determined by content register = content old ( bitwise_ or ) content new . if content register equals content new , a re - write is possible ; e.g., this is not the case for content old = ffff hex and content new ffff hex . d epending on the former and the newly intended mtp address es and register co ntent s a re - programming could be possible. 2.4.3. clock generator the clock generator , implemented as a ring oscillator, provides a 3 mhz clock signal. the frequency is trimmed during production test. 2.4.4. power supervision the p ower s upervision block as a part of the voltage regulator combined with the digital section monitors all power supplies to ensure a defined reset of all digital blocks during power - up or power supply interruptions. 2.4.5. interface the zssc 3036 can communicate with the user?s pc via a n spi or i 2 c ? interface * . the interface type is select - able via the voltage level on the sel pin : ? sel = 0 - > spi m ode ? sel = 1 - > i 2 c ? m ode if the sel pin is not connected, i2c ? communication will be selected (ic - internal pull - up at sel pin). t he spi - speci fic pins (ss, miso) do not need to be connected for i2c ? operation. to also provide interface ac c essibility in sleep s tate (all features inactive except for the digital interface logic) , the interface circuitry is directly supplied by vdd. * f unctional i 2 c? interface properties correspond to the nxp i2c? bus specification rev. 0.3 (june 2009) .
zssc3036 datasheet ? 2016 integrated device technology, inc. 19 april 20, 2016 3 functional description 3.1. power up specifications for this section are given in sections 1.2 and 1.3 . on power - up, the zssc 3036 communication interface is able to receive the first command after a time t sta1 from when the vdd supply is within operating specifications . the zssc 3036 can begin the first measurem ent after a time of t sta2 . from when the vdd supply is operational. the wake up time from sleep state to active state (see section 3.3 ) after receiving the a ctivating command i s defined as t wup1 and t wup2 . in c ommand m ode , subsequent commands can be sent after t wup1 . the first measurement start s after t wup2 if a measurement request was sent . 3.2. measurements available measurement procedures are ? azbm: auto - zero bridge measurement ? bm: bridge measurement ? aztm: auto - zero temperature measurement ? tm: temperature measurement azbm: the configuration for bridge measurement s is loaded. the mul t iplexer block connects the a mplifier input to the agnd analog ground reference . an analog - to - digital conversion is performed so that the inherent system offset for the bridge configuration is converted by the adc to a 16- bit digital word. bm: the configuration for bridge measurement s is loaded. the mul t iplex er connects the a mplifier input to the bridge pins inp and inn. an analog - to - digital conversion is performed . the result is a 16 - bit digital word. aztm: the configuration for temperature measurement s is loaded. the mul t iplexer connects the a mplifier input to agnd. an analog - to - digital conversion is performed so that the inherent system offset for the temperature configuration is converted by the adc to a 16 - bit digital word. tm: the configuration for temperature measurement s is loaded. the mul t iplexer conne cts the amplifier input to the internal temperature sensor. an analog - to - digital conversion is performed . the result is a 16- bit digital word. the typical application?s measurement cycle is a complete ssc m easurement (using the command ac hex ) with azbm, bm, aztm, and tm followed by a signal correction calculation. 3.3. operational modes figure 3 . 1 illustrates the zssc 3036 power - up sequence and subseq uent operation depending on the selected interface communication mode (i 2 c? or spi) as determined by the sel pin voltage level (see section 2.4.5 ) . with either interface, after the voltage regulators are switched on, the zssc 3036 ?s low voltage section (lv) is active while the related interface configuration information is read from memory . then the lv section is switched off , the zssc 3036 goes in to s leep state , and t he interface is ready to receive commands. since the interface is always powered by v dd , it is referred to as the high voltage section (hv). s ee table 3 . 1 for definitions of the command s .
zssc3036 datasheet ? 2016 integrated device technology, inc. 20 april 20, 2016 figure 3 . 2 shows the zssc 3036 operation in normal mode and command mode including when the lv and hv sections are active as indicated by the color legend . the normal mode automatically returns to sleep state after executing the requested measurements. in command mode , the zssc 3036 remains active if a dedicated command (start_nom) wa s sent, which is helpful during calibration. command mode can only be entered if start_cm is the first command received after por.
zssc3036 datasheet ? 2016 integrated device technology, inc. 21 april 20, 2016 figure 3 . 1 operational flow chart: power u p receive : command hv - operation lv - operation sel == 1 no ( spi ) yes ( i 2 c tm ) i 2 c tm - interface spi - interface command : load ic - i 2 c addr . lv operation ic power on power down ( switch off lv and wait for command ) save : ic i 2 c address / data / status color legend : received i 2 c slave _ addr == ic i 2 c slave _ addr yes io _ mode = i 2 c tm io _ mode = spi switch off pull - up at sel execute : data fetch read _ bit == 1 ( data fetch ) yes no data / status from lv commandmode == active yes no power up lv command : load i / o setup lv operation save : setup / data / status data / status from lv power up lv power down ( switch off lv and wait for command ) ss == 1 yes execute : data fetch received cmd == read _ df yes commandmode == active yes no no receive : command no no
zssc3036 datasheet ? 2016 integrated device technology, inc. 22 april 20, 2016 figure 3 . 2 operational flow chart: command mode and normal mode sleep mode receive : command start _ nom execute : command hv - operation lv - operation color legend : cmd == s tart _ cm yes no get command from hv command mode case ( command ) regular _ cmd invalid _ cmd data / status from lv cm active start lv end lv cm inactive execute : command case ( command ) regular _ cmd invalid _ cmd data / status from lv 3.4. command interpretation 3.4.1. spi/i 2 c ? c ommands the user - accessible section of memory includes addresses 00 hex through 17 hex in the otp memory that is designated by the user memory page pointer. because each of the four otp memor y pages cannot be re written or erased, the memory page pointer must be incremented to the next otp memory page in order to write to memory again (see table 3 . 1 for the command). after all four user - accessible otp memor y page s have been used, further write operati ons are not possible and the ? memory full ? bit is returned as set in the status byte after write operations (see section 3.5.1 ).
zssc3036 datasheet ? 2016 integrated device technology, inc. 23 april 20, 2016 the spi/i 2 c ? commands supported by the zssc 3036 are listed in table 3 . 1 . the comman d to read an address in the user memory is the same as its address. the command to read the 16 - bit memory status of the data at an address in user memory is the address plus 20 hex . the command to write to an address in user memory is the address plus 40 hex . the re is a n idt - reserved section of memory that can be read but not over - written by the user. table 3 . 1 spi/i 2 c ? commands note: every return starts with a status byte followed by the data word as described in section 3.5.1 . command (byte) return description normal mode command mode 00 hex to 17 hex 16- bit user data read data in the user memory address (00 hex to 17 hex ) matching the command (m ight not be using all addresses ). yes yes 20 hex to 37 hex 16- bit user memory status read memory status for address specified by command minus 20 hex ( address es 00 hex to 17 hex respectively ; see section 3.6.2 for a description of the memory status ). yes y es 40 hex to 57 hex followed by data (0000 hex to ffff hex ) ? write data to user memory at address specified by command minus 40 hex ( address es 00 hex to 17 hex respectively; might not be using all addresses) . no yes 70 hex to 7e hex 16- bit idt - reserved memory data read data in idt - reserved memory at address specified by command minus 70 hex ( second set of address es 00 hex to 0e hex respectively ). no yes 80 hex to 8e hex 16- bit idt - reserved memory status read memory status bytes for idt - reserved memory data at address specified by command minus 80 hex ( second set of address es 00 hex to 0e hex respectively; see section 3.6.2 for a description o f the memory status bytes) . no yes 5e hex ? increment user memory page pointer . no yes a0 hex to a7 hex followed by xxxx hex (see table 3 . 2 ) 16- bit wide raw data get_raw this command can be used to perform a measurement and write the raw adc data into the output register. the lsb of the command determines how the afe c onfig uration register is loaded for the get_raw measurement (see table 3 . 2 ). yes yes a8 hex ? start_nom exit command mode and transition to normal mode. no yes a9 hex ? start_cm exit normal mode and transition to command mode. yes no
zssc3036 datasheet ? 2016 integrated device technology, inc. 24 april 20, 2016 command (byte) return description normal mode command mode aa hex ? write_checksumc if not yet written, the checksum for the valid user mtp page is cal - culated and written to mtp. no yes ac hex 16- bit fully corrected bridge measurement data + 16 - bit corrected internal temperature measure t rigger s full measurement cycle (azbm, bm, aztm, and tm , as described in section 3.2 ) and calculation and storage of data in interface ( configurations from mtp ). yes yes f x hex status followed by last d ata nop o nly valid for spi (see 3.5.1 and 3.5.2 ). yes yes table 3 . 2 get_raw commands command measurement afe configuration register a0 hex followed by 0000 hex bm ? bridge measurement b m _config a1 hex followed by ssss hex bm ? bridge measurement ssss is the user?s configuration setting for the measure - ment provided via the interface. the format and pur - pose of configuration bits must be according to the definitions for bm_config . a2 hex followed by 0000 hex bm - azbm ? auto - zero c orrected bridge measurement 1) b m _config a3 hex followed by ssss hex bm - azbm ? auto - zero c orrected bridge measurement 2) ssss is the user?s configuration setting for the measure - ment provided via the interface. the format and pur - pose of configuration bits must be according to the definitions for bm_config . a4 hex followed by 0000 hex tm ? temperature measurement idt - defined register a5 hex followed by ssss hex tm ? temperature measurement ssss is the user?s configuration setting for the measure - ment provided via the interface. the format and pur - pose of co nfiguration bits must be according to the definitions for bm_config being valid for temp erature measurement in this case (bits [15:13] will be ignored). a6 hex followed by 0000 hex tm - aztm ? auto - zero c orrected temperature measurement 1) idt - defined register a7 hex followed by ssss hex tm - aztm ? auto - zero c orrected temperature measurement 2) ssss is the user?s configuration setting for the measure - ment provided via the interface. the format and pur - pose of configuration bits must be a ccording to the definitions for bm_config being valid for temp erature measurement in this case (bits [15:13] will be ignored). 1) recommended for raw data collection during calibration coefficient determination using pre - programmed (in mtp) measurement setups . 2) recommended for raw data collection during calibration coefficient determination using un - programmed (not in mtp), external measurement setups ; e.g. , for evaluation purposes .
zssc3036 datasheet ? 2016 integrated device technology, inc. 25 april 20, 2016 3.5. communication interface 3.5.1. common f unctionality commands are handled by the command interpreter in the lv section . commands that need additional data are not treated differently than other commands because the hv interface is able to buffer the command and all the data that belongs to the command and the command interpreter i s activated as soon as a command byte is received . every response starts with a status byte followed by the data word. the data word d epends on the previous command. it is possible to read the same data more than once if the read request is repeated (i 2 c ?) or a nop command is se nt (spi). if the next command is not a read request (i2c ? ) or a nop (spi), it invalidates any previous data. the status byte contains the following bits (see table 3 . 3 , table 3 . 4 , and table 3 . 5 for sequence): ? power indication ( b it 6) : 1 if the device is powered (v dd b on ); 0 if not powered. this is needed for spi m ode where the master reads all zero s if the device is not powered or in power - on reset (por) . ? busy indication ( b it 5) : 1 if the device is busy, which indicates that the data for the last command is not ava ilable yet. no new commands are processed if the device is busy . ? actual zssc 3036 mode ( b its 4:3) : 00 = normal mode; 01 = command mode ; 1 x = idt - r eserved . ? memory integrity/error flag ( b it 2) : 0 if integrity test passed, 1 if test failed. this bit indicates whether the checksum - based integrity check passed or failed. correctable errors are not reported but can be queried with the memory status commands (see section 3.6.2 ) . the memory error status bit is calculated only during the power - up sequence , so a newly written crc will only be used for memory verification and status update after a subsequent zssc3036 power - on reset (por) . ? data transfer /correction ( b it 1) : if the last command was a memory write, this bit is 0 if the last memory write was successful (memory not full yet) ; otherwise it is 1 (e.g. , page increase but already on last mtp page) . if the last command was a memory read, this bit is 1 if the data was corrected. table 3 . 3 general status byte bit 7 6 5 4 3 2 1 0 meaning 0 powered ? busy ? mode memory e rror ? internal d ata t ransfer special table 3 . 4 status byte for read operations bit 7 6 5 4 3 2 1 0 meaning 0 powered ? busy ? mode memory error ? data corrected ? alu saturation ? table 3 . 5 status byte for write operations bit 7 6 5 4 3 2 1 0 meaning 0 powered ? busy ? mode memory error ? memory full ? ? mtp write reject ? don?t care
zssc3036 datasheet ? 2016 integrated device technology, inc. 26 april 20, 2016 msb sclk ( cpol = 0 ) bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 lsb msb bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 lsb sclk ( cpol = 1 ) mosi miso / ss sample cpha = 0 table 3 . 6 mode status status[4:3] mode 00 normal m ode 01 command mode 10 idt - reserved 11 command m ode and reserved further status information is provided by the eoc pin. the eoc pin is set high when a measurement and calculation have been completed. 3.5.2. spi the spi m ode is available w hen the sel pin = 0. the polarity and phase of the spi clock are programmable via the ckp_cke setting in address 02 hex as described in table 3 . 8 . ckp_cke is two bits: cpha (bit 10) , which selects which edge of sclk latches data, and cpol (bit 11) , which indicates whether sclk is high or low when it is idle. the polarity of the ss sign al and pin are programmable via the ss_polarity setting (bit 9). the different combinations of polarity and phase are illustrated in the figures below. figure 3 . 3 spi c onfiguration cpha=0
zssc3036 datasheet ? 2016 integrated device technology, inc. 27 april 20, 2016 msb sclk ( cpol = 0 ) bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 lsb msb bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 lsb sclk ( cpol = 1 ) mosi miso / ss sample cpha = 1 cmddat < 15 : 8 > cmddat < 7 : 0 > command other than nop status data data command request mosi miso note : a command request always consists of 3 b ytes . if the command is shorter , then it must be completed with 0 s . the data on miso depend on the preceding command . figure 3 . 4 spi configuration cpha=1 in spi mode , each command except nop is started as shown in figure 3 . 5 . after the execution of a command (busy = 0) , the expected data can be read as illustrated in figure 3 . 6 or if no data are returned by the command , the next command can be sent . the st atus can be read at any time with the nop command (see figure 3 . 7 ). figure 3 . 5 spi command request
zssc3036 datasheet ? 2016 integrated device technology, inc. 28 april 20, 2016 command = nop status read status mosi miso status memdat <15: 8 > memdat <7 : 0 > bridgedat <15: 8 > bridgedat <7 : 0 > tempdat <15: 8 > tempdat <7 : 0 > command = nop 00 hex 00 hex status command = nop 00 hex 00 hex 00 hex 00 hex read data mosi (a ) example : after the completion of a memory read c ommand miso (b ) example : after the completion of a f ull me asurement command (ac hex ) mosi miso figure 3 . 6 spi read status figure 3 . 7 spi read data
zssc3036 datasheet ? 2016 integrated device technology, inc. 29 april 20, 2016 s slaveaddr a 0 command a p s slaveaddr 0 a command a cmddat <15:8> a cmddat <7:0> a p command request (i 2 c? write) write write from master to slave from slave to master s start condition p stop condition a n acknowledge not acknowledge s slaveaddr 1 a status n p read status ( i 2 c ? read ) read 3.5.3. i 2 c ? i 2 c m ode is selected by the sel pin = 1. in i 2 c m ode, each command is started as shown in f igure 3.8 . only the number of bytes that is needed for the command must be sen t . an exception is the hs - mode where 3 b ytes must always be sent as in spi m ode. after the execution of a command (busy = 0) , the expected data can be read as illustrated in figure 3 . 10 or if no data are returned by the command , the next command can be sen t . the status can be read at any time as described in figure 3 . 9 . figure 3 . 8 i 2 c ? command request figure 3 . 9 i 2 c ? read status
zssc3036 datasheet ? 2016 integrated device technology, inc. 30 april 20, 2016 s slaveaddr 1 a status a memdat <15:8> a memdat <7:0> n p s slaveaddr 1 a status a bridgedat <15:8> a bridgedat <7:0> n p a tempdat <15:8> a tempdat <7:0> read data (i 2 c? read) (a) example: after the completion of a memory read command read (b) example: after the completion of a full measurement command (ac hex ) read figure 3 . 10 i 2 c ? read data all mandatory i2c - bus protocol features are implemented. optional features like c lock s tretching, 10 - bit slave address, etc. , are not supported by the zssc 3036 ?s interface. in i2c - high - speed mode, a command consists of a fixed length of three bytes. 3.6. memory in the zssc 3036 , the memory is organized page - wise and can be programmed multiple (4) time s (mtp). each register can only be programmed once per page. the valid page is determined by the page counter which can be incremented with the command 5e hex ? this leads to a ? reset ? of all registers and a re - programming is necessary . increasing the customer page counter will disable all old register contents of the former page. it is possible to (re - )program a total of 4 pages. resetting the page counter is not possible. the page counter starts with 0 and can be incremented to a maximum of 3. if the 4 th memory page has been used, no further changes in the memory are possible ? careful writing and page incremen ting is strongly recommended. there are two mtp page types: ? customer page: accessible by means of regular write operations ( 40 hex to 57 hex ). it cont ains: the customer id , interface setup data, measurement setup information, calibration coefficients, etc. ? idt page: only accessible for write operations by idt . the idt page contains specific trim information and is programmed during manufacturing test by idt . 3.6.1. programming memory programming memory requires a specific supply voltage level (> 2.9v) at the v dd pin (see section 1.3 for specifications) . the mtp programming voltage itself is generated by means of an implemented charge pump , generating an internal memory programming voltage (vpp) ; no additional, external voltage , other than vdd needed . the program timing is shown in figure 3 . 11 . supplying the zssc 3036 with vdd> 2.9 v during memory programming is re quired . after the memory is programmed , it must be read again to verify the validity of the memory content s .
zssc3036 datasheet ? 2016 integrated device technology, inc. 31 april 20, 2016 start _cm command memwr memwr memory write customer address memwr memwr vpp memrd memrd memory read customer address t vpp t vpp figure 3 . 11 memory program operation 3.6.2. memory status command s the 16- bit memory status answer for the commands: 20 hex to 37 hex and 80 hex to 8e hex contains the following information : ? one bit indicating if the data read was corrected. ? two bits indicating the current page i n use. table 3 . 7 memory status word bit description 15 (msb) data was corrected (0: no, 1: yes) 14 current p age 13 1 2 :0 undefined ? do not use
zssc3036 datasheet ? 2016 integrated device technology, inc. 32 april 20, 2016 3.6.3. memory content s table 3 . 8 mtp memory content assignments mtp address word / bit range default setting description notes / explanations 00 hex 15:0 0000 hex cust_id0 customer id byte 0 (combines with m emory word 01 hex to form customer id) 01 hex 15:0 0000 hex cust_id1 customer id byte 1 (combines with m emory word 0 0 hex to form customer id) interface configuration 02 hex 6:0 000 0000 bin slave_addr i2c ? slave address; valid range: 00 hex to 7f hex (default: 00 hex ), remark: address codes 04 hex to 07 hex are reserved for entering the i 2 c ? h igh s peed m ode 8:7 00 bin - reserved 9 0 bin ss_polarity determines the polarity of the s lave s elect pin (ss) for spi operation: ? 0 ? slave s elect is active low (spi and zssc 3036 are active i f ss==0) ? 1 ? slave s elect is active high (spi and zssc 3036 are active if ss==1) 11:10 00 bin ckp_cke clock polarity and clock - edge select ? determines polarity and phase of spi interface clock with the following modes: ? 00 ? sclk is low in idle state, data latch with rising edge and data output with falling edge ? 01 ? sclk is low in idle state, data latch with falling edge and data output with rising edge ? 10 ? sclk is high in idle state, data latch with falling edge and data output with rising edge ? 11 ? sclk is high in idle state, data latch with rising edge and data output with falling edge 15:12 - not assigned
zssc3036 datasheet ? 2016 integrated device technology, inc. 33 april 20, 2016 mtp address word / bit range default setting description notes / explanations signal conditioning parameter s 03 hex 0 0 bin offset_b[16] bridge offset, bit[16] ? functions as the msb and combine s with offset_b[15:0] in 05 hex to form the 17- bit coefficient?s absolute value 1 0 bin offset_b_sign sign for sensor bridge offset (off set_b): 0 => a positive value or 1 => a negative value 2 0 bin gain_b[16] bridge gain, bit[16] ? functions as the msb and combines with gain_b[15:0] in 06 hex to form the 17- bit coefficient?s absolute value 3 0 bin gain_b_sign sign of the sensor bridge gain (gain_b): 0 => a positive value or 1 => a negative value 4 0 bin tcg[16] 1 st - order temperature coefficient of the bridge gain, bit[1 6 ] ? functions as the msb and combines with tcg[15:0] in 07 hex to form the 17- bit coefficient?s absolute value 5 0 bin tcg_sign sign of 1 st - order temperature coeffi cient (tcg) : 0 => a positive value or 1 => a negative value 6 0 bin tco[16] 1 st - order temperature coefficient of the bridge offset, bit [ 16] ? functions as the msb and combines with tco[15:0] in 08 hex to form the 17- bit coefficient?s absolute value 7 0 bin tco_sign sign of 1 st - order temperature coefficient (tco): 0 => a positive value or 1 => a negative value 8 0 bin sot_tco[16] 2 nd - order temperature coefficient of the bridge offset, bit [ 16] ? functions as the msb and combines with sot_ t co[15:0] in 09 h ex to form the 17- bit coefficient?s absolute value 9 0 bin sot_tco_sign separate sign setting for 2 nd - order tempe rature coefficient (sot_tco) : 0 => a positive value or 1 => a negative value 10 0 bin sot_tcg[16] 2 nd - order temperature coef ficient of the bridge gain, bit [16] ? functions as the msb and combines with sot_ t cg[15:0] in 0a hex to form the 17- bit coefficient?s absolute value 11 0 bin sot_tcg_sign separate sign setting for 2 nd - order temperature coefficient (sot_tcg): 0 => a positive value or 1 = > a negative value
zssc3036 datasheet ? 2016 integrated device technology, inc. 34 april 20, 2016 mtp address word / bit range default setting description notes / explanations 12 0 bin sot_bridge[16] 2 nd - order coefficient of the bridge signal , bit[16] ? functions as the msb and combines with sot_bridge[15:0] in 0b hex to form the 17- bit coefficient?s absolute value 13 0 bin sot_bridge_sign separate sign setting for 2 nd - order bridge coefficient (sot_bridge) : 0 => a positive value or 1 => a negative value 14 0 bin sot_curve type of second - order curve correction for the bridge sensor signal. 0 ? parabolic curve 1 ? s - shaped curve 15 0 bin tsetl_sign separate sign setting for t _ setl : 0 => a positive value or 1 => a negative value 04 hex 0 0 bin gain_t[16] temperature gain of temp erature sensor , bit[16] ? functions as the msb and combines with gain_t[15:0] in 0d hex to form the 17- bit coefficient?s absolute value 1 0 bin gain_t_sign separate sign setting for the temperature gain (gain_t) : 0 => a positive value or 1 => a negative value 2 0 bin sot_t[16] 2 nd - order temperature coefficient of temperature sen sor , bit [16] ? functions as the msb and combines with sot_t[15:0] in 0e hex to form the 17- bit coefficient?s absolute value 3 0 bin sot_t_sign separate sign setting for 2 nd - order te mperature coefficient (sot_t): 0 => a positive value or 1 => a negative value 4 0 bin offset_t[16] temperature offset of temp erature sensor, bit[16] ? functions as the msb and combines with offset_t[15:0] in 0c hex to form the 17- bit coefficient?s absolute value 5 0 bin offset_t_sign separate sign setting for the temperature offset (offset_t): 0 => a p ositive value or 1 => a negative value 15:6 0 000 0 000 0 bin - not assigned
zssc3036 datasheet ? 2016 integrated device technology, inc. 35 april 20, 2016 mtp address word / bit range default setting description notes / explanations 05 hex 15:0 0000 hex (7000 hex ) offset_b[15:0] bits [15:0] of the bridge offset correction coefficient, which is an 18 - bit wide absolute value ( the respective msbs offset_b [16] and sign, offset_b_sign , are under bit s [1:0] in 03 hex ) [ - 1/16 to 15/16] = 7000 hex (default for volume) [ - 2/16 to 14/16] = 6000 hex [ - 3/16 to 13/16] = 5000 hex [ - 4/16 to 12/16] = 4000 hex [ - 5/16 to 11/16] = 3000 hex [ - 6/16 to 10/16] = 2000 hex [ - 7/16 to 9/16] = 1000 hex [ - 8/16 to 8/16] = 0000 hex (default for proto types ) 06 hex 15:0 0000 hex (8000 hex ) gain_b[15:0] bits[15:0] of 1 7 - bit wide absolute value of the bridge gain coefficient (default for prototypes : 0000 h ex ; default for volume production : 8000 h ex ? the respective msbs, gain_b[16] and sign, gain_b_sign , are under bit s [3:2] in 03 hex ) 07 hex 15:0 0000 hex tcg[15:0] coefficient for temperature correction of the bridge gain term ? the respective msbs, tcg[16] and sign, tcg_sign , are under (bit s [5:4] in 03 hex ) 08 hex 15:0 0000 hex tco[15:0] coefficient for temperature correction of the bridge offset term ? the respective msbs, tco[16] and sign, tco_sign , are under (bit s [7:6] in 03 hex ) 09 hex 15:0 0000 hex sot_tco[15:0] 2 nd order term applied to tco ? the respective msbs, sot_tco[16] and sign, sot_tco_sign , are under (bit s [9:8] in 03 hex ) 0a hex 15:0 0000 hex sot_tcg[15:0] 2 nd order term applied to tcg. ? the respective msbs, sot_tcg[16] and sign, sot_tcg_sign , are under (bit s [11:10] in 03 hex ) 0b hex 15:0 0000 hex sot_bridge[15:0] 2 nd order term applied to the sensor bridge readout ? the respective msbs, sot_bri d ge[16] and sign, sot_bridge_sign are under (bit s [13:12] in 03 hex ) 0c hex 15:0 0000 hex (7000 hex ) offset_t[15:0] bits [15:0] of the t emperature offset correction coefficient ( the respective msbs, offset_t[16] and sign, offset_t_sign , are under (bit s [5:4] in 04 hex ) [ - 1/16 to 15/16] = 7000 h ex (default for volume) [ - 2/16 to 14/16] = 6 000 h ex [ - 3/16 to 13/16] = 5000 h ex [ - 4/16 to 12/16] = 4000 h ex [ - 5/16 to 11/16] = 3000 h ex [ - 6/16 to 10/16] = 2000 h ex [ - 7/16 to 9/16] = 1000 h ex [ - 8/16 to 8/16] = 0000 h ex (default for prototypes)
zssc3036 datasheet ? 2016 integrated device technology, inc. 36 april 20, 2016 mtp address word / bit range default setting description notes / explanations 0d hex 15:0 0000 hex (8000 hex ) gain_t[15:0] bits [15:0] of the a bsolute value of the temperature gain coefficient (default for prototypes: 0000 hex ; default for volume production: 8000 h ex ); the respective msbs, gain_t[16] and sign, gain_t_sign , are under bit s [1:0] in 04 hex ) 0e hex 15:0 0000 hex sot_t[15:0] 2 nd order term applied to the temperature reading ? the respective msbs, sot_t[16] and sign, sot_t_sign , are under (bit s [3:2] in 04 hex ) 0f hex 15:0 0000 hex t_setl stores raw temperature reading at the temperature at which low calibration points were taken measurement configuration register ( bm_config ) 10 hex 1:0 00 bin gain_stage1 gain setting for the 1 st premp stage with gain_stage1: ? 00 ? 12 ? 01 ? 2 0 ? 10 ? 3 0 ? 11 ? 4 0 4:2 000 bin gain_stage2 gain setting for the 2 nd preamp stage with gain_stage2: ? 000 ? 1.1 ? 001 ? 1.2 ? 010 ? 1.3 ? 011 ? 1.4 ? 100 ? 1.5 ? 101 ? 1.6 ? 110 ? 1.7 ? 111 ? 1.8 5 0 bin gain_polarity set up the polarity of the sensor bridge?s gain (inverting of the chopper) with ? 0 ? positive (no polarity change) ? 1 ? negative (180 polarity change) 7:6 00 bin (11 bin ) msb absolute number of bits for the msb conversion in the adc with msb : ? 00 ? 10- bit ? 01 ? 12- bit ? 10 ? 14- bit ? 11 ? 16- bit
zssc3036 datasheet ? 2016 integrated device technology, inc. 37 april 20, 2016 mtp address word / bit range default setting description notes / explanations 9:8 00 bin lsb a bsolute number of bits for the l sb conversion in the adc with lsb : ? 00 ? 0 - bit (single stage adc) ? 01 ? 2 - bit ? 10 ? 4 - bit ? 11 ? 6 - bit 12:10 000 bin a2d_offset adc offset and resulting a2d i nput r ange [vref] with a2d_offset: ? 000 ? 1/16 results in range [ - 1/16, 15/16] ? 001 ? 2/16 results in range [ - 2/16, 14/16 ? 010 ? 3/16 results in range [ - 3/16, 13/16] ? 011 ? 4/16 results in range [ - 4/16, 12/16] ? 100 ? 5/16 results in range [ - 5/16, 11/16] ? 101 ? 6/16 results in range [ - 6/16, 10/16] ? 110 ? 7/16 results in range [ - 7/16, 9/16] ? 111 ? 8/16 results in range [ - 8/16, 8/16] 14:13 00 bin temp_adc selection between fixed adc segmentations for temperature measurements: ? 00 ? setup according to idt - reserved memory (recommended setup for best performance and speed trade - off) ? 01 ? msb=16, lsb=0 (16 - bit) ? 10 ? msb=10, lsb=6 (16 - bit) ? 11 ? msb=12, lsb=4 (16 - bit) 15 0 bin - reserved 11 hex not assigned 12 hex not assigned 13 hex not assigned 14 hex not assigned 15 hex not assigned 16 hex not assigned 17 hex 15:0 - checksumc generated (checksum) for user page through a linear feedback shift register (lfsr); signature is checked with power - up to ensure memory content integrity the memory integrity checksum ( referred to as crc) is generated through a linear feedback shift register with the polynomial: g(x) = x 16 + x 15 + x 2 + 1 with the initial ization value : ffff hex .
zssc3036 datasheet ? 2016 integrated device technology, inc. 38 april 20, 2016 3.7. calibration sequence calibration essentially involves collecting raw signal and temperature data from the s ensor - ic system for different known bridge values and temperatures. this raw data can then be processed by the calibration master (assumed to be a pc), and the calculated calibration coefficients can then be written to mtp memory. below is a brief overview of the steps involved in calibrating the zssc 3036 . there are three main steps to calibration: 1. assigning a unique identification to the zss c 3036 . this identification is written to s hadow ram and later programmed in mtp memory. this unique identification can be stored in the two 16 - bit registers dedicated to customer id. it can be used as an index into a database stored on the calibration pc. this database will contain all the raw values of bridge readings and temperature readings for that part, as well as the known bridge measurand conditions and temperature to which the bridge was exposed. 2. data collection. data collection involves getting un corrected or raw data from the bridge at different known measurand values and temperatures. then this data is stored on the calibration pc using the unique identification of the device as the index to the database. 3. coefficient calculation and storage in mt p memory. after enough data points have been collected to calculate all the desired coefficients, the coefficients can be calculated by the calibrating pc and written to the s hadow r am. after that, mtp memory is programmed with the contents of the shadow ram . 4. result . t he sensor signal and the characteristic temperature effect on output will be linearized according to the setup - dependent maximum output range. it is essential to perform the calibration with a fixed programming setup during the data collecti on phase. in order to prevent any accidental misprocessing, it is further recommended to keep the mtp memory setup stable during the whole calibration process as well as in the subsequent operation. a zssc 3036 calibration only fits the single setup used du ring its calibration . changes of functional parameters after a successful calibration can decrease the precision and accuracy performance of the zssc 3036 as well as of the whole application.
zssc3036 datasheet ? 2016 integrated device technology, inc. 39 april 20, 2016 3.7.1. calibration step 1 ? assigning unique i dentification assign a unique identification number to the zssc 3036 by using the memory write command (40 hex + data and 41 hex + data; see table 3 . 1 and table 3 . 8 ) to write the identification number to cust_id0 at memory address 00 hex and cust_id1 at address 01 hex as described in section 3.6.1 . these two 16 - bit registers allow for more than 4 trillion unique devices. 3.7.2. calibration step 2 ? data collection the number of unique points ( measurand and/or temperature) at which calibration must be performed generally depends on the requirements of the application and the behavior of the resistive bridge in use. the minimum number of points required is equal to the number of bridge coefficients to be c orrected with a minimum of three different temperatures at three different bridge values . for a full calibration resulting in values for all 7 possible bridge coefficients and 3 possible temperature coefficients, a minimum of 7 pairs of bridge with tempera ture measurements must be collected. within this minimum 3x3 measure ments field , data must be collected for the specific value pairs (at known conditions) and then processed to calculate the coefficients . in order to obtain the potentially best and most ro bust coefficients, it is recommended that measurement pairs (temperature vs. measurand ) be collected at the outer corners of the intended operation range or at least at points that are located far from each other. it is also essential to provide highly pre cise reference values as nominal, expected values. the measurement precision of the external calibration - measurement equipment should be ten times more accurate than the expected zssc 3036 output precision after calibration in order to avoid precision losse s caused by the nominal reference values (e.g. , measurand signal and temperature deviations). note : an appropriate selection of measurement pairs can significantly improve the overall system performance. the determination of the measurand - related coefficients will use all of the measurement pairs. for the temperature - related correction coefficients, 3 (at three different temperatures) of the measurement pairs will be used. note: there is an inherent redundancy in the 7 bridge - related and 3 tempera ture - related coefficients. since the temperature is a necessary output (which also needs correction), the temperature - related information is mathematically separated, which supports faster and more efficient dsp calculations during the normal usage of the sensor - ic system. the recommended approach for data collection is to make use of the raw - measurement commands: ? f or bridge sensor values : o a 2 hex + 0000 hex : single bridge measurement for which the configuration register will be loaded from the b m _config register (10 hex in mtp); p reprogramming the measurement setup in the mtp is required. o a3 hex + ssss hex : single bridge measurement for which the bm_config c onfiguration register (gain, adc, offset, etc.) will be loaded as ssss hex and must be provided externally via the interface.
zssc3036 datasheet ? 2016 integrated device technology, inc. 40 april 20, 2016 ? f or temperature values : o a6 hex + 0000 hex : single temperature measurement for which the configuration register will be loaded from an internal temperature configuration register (preprogrammed by idt in mtp ); preprogramming of the respective configuration is done by idt prior to ic delivery . this is the recommended a pproach for temperature data collection. o a7 hex + ssss hex : single te mperature measurement for which the configuration registe r (gain, adc, offset, etc.) will be loaded as ssss hex and must be provided externally via the interface. the data composition of the temperature configuration register is similar to the bm_config (address 10 hex ) register for the bridge sensor. 3.7.3. calibration step 3 ? coefficient calculations the math to perform the coefficient calculation is complicated and will not be discussed in detail. there is a brief overview in the next section. idt will provide software (dlls) to perform the coefficient calculation (externa l to the s ensor - ic system) based on auto - zero corrected v alues. after the coefficients are calculated, the final step is to write them to the mtp memory of the zssc 3036 . 3.8. the calibration math 3.8.1. bridge signal compensation the saturation check in the zssc 3036 is enhanced compared with older sscs from idt . even saturation effects of the internal calculation steps are detected, allowing the final correction output to still be determined. it is possible to get potentially useful signal conditioning results wh ich have had an intermediate saturation during the calculations ? these cases are detectable by observing the status bit[0] for each measurement result. details about the saturation limits and the valid ranges for values are provided in the following equat ions. sot_curve selects whether second - order equations compensate for sensor nonlinearity with a parabolic or s - shaped curve. the parabolic compensation is recommended.
zssc3036 datasheet ? 2016 integrated device technology, inc. 41 april 20, 2016 the correction formula for the differential signal reading is represented as a two - step process depending on the sot_curve setting. equations for the parabolic sot_curve setting ( sot_curve = 0): simplified: setl t raw t t ? = ? _ (5) ? ? ? ? ? ? + ? ? ? ? + = tcg t tcg sot t k 15 15 15 1 2 _ 2 2 (6) ? ? ? ? ? ? + ? ? ? ? + + = tco t tco sot t raw br b offset k 15 15 2 2 _ 2 _ _ (7) 15 2 15 1 15 2 2 2 _ + ? ? = k k b gain z bp ( delimited to positive number range) (8) ? ? ? ? ? ? + ? ? = 15 15 15 2 2 _ 2 bp bp z bridge sot z b ( delimited to positive number range) (9) complete: [ ] 1 2 2 17 17 _ ? ? ? = ? setl t raw t t (10) 1 2 2 1 2 2 1 2 2 1 2 2 15 15 15 1 17 17 17 17 17 17 17 17 2 _ 2 2 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? + ? ? ? ? ? ? ? ? ? ? + = tcg t tcg sot t k (11) 1 2 2 1 2 2 1 2 2 1 2 2 1 2 2 15 15 2 17 17 17 17 17 17 17 17 17 17 2 _ 2 _ _ ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? + ? ? ? ? ? ? ? ? ? ? + + = tco t tco sot t raw br b offset k (12) 1 2 0 15 1 2 2 1 2 2 2 15 1 15 17 17 17 17 17 2 2 2 _ ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? + ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? = k k b gain z bp (13) 1 2 0 1 2 2 15 1 2 2 15 15 16 17 17 17 17 2 2 _ 2 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? + ? ? ? ? ? ? ? ? = bp bp z bridge sot z b (14)
zssc3036 datasheet ? 2016 integrated device technology, inc. 42 april 20, 2016 equations for the s - shaped sot_curve setting ( sot_curve = 1): simplified: 2 15 1 15 2 2 _ k k b gain z bs ? ? = (15) 15 15 15 15 2 2 2 _ 2 + ? ? ? ? ? ? + ? ? = bs bs z bridge sot z b ( delimit ed to positive number range) (16) complete: 1 2 2 1 2 2 2 15 1 15 17 17 17 17 2 2 _ ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? = k k b gain z bs (17) 16 17 17 17 17 17 17 2 0 15 1 2 2 1 2 2 15 1 2 2 15 15 2 2 2 _ 2 ? ? ? ? ? ? ? ? ? ? ? ? + ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? + ? ? ? ? ? ? ? ? = ? ? ? ? ? ? bs bs z bridge sot z b (18) where b = corrected bridge reading output via i 2 c ? or spi; range [0 hex to ffff hex ]; br_raw = raw bridge reading from adc after az correction; range [ - 1ffff hex to 1ffff hex ]; gain _b = bridge gain term; range [ - 1ffff hex to 1ffff hex ]; offset _b = bridge offset term; range [ - 1ffff hex to 1ffff hex ]; tcg = temperature coefficient gain term; range [ - 1ffff hex to 1ffff hex ]; tco = temperature coefficient offset term; range [ - 1ffff hex to 1ffff hex ]; t_raw = raw temperature reading after az correction; range [ - 1ffff hex to 1ffff hex ]; t setl = t_raw reading at which low calibration was performed (e.g. , 25c); range [ - ffff hex to ffff hex ]; sot _tcg = second - order term for tcg non - linearity; range [ - 1ffff hex to 1ffff hex ]; sot _tco = second - order term for tco non - linearity; range [ - 1ffff hex to 1 ffff hex ]; sot_bridge = second - order term for bridge non - linearity; range [ - 1ffff hex to 1ffff hex ]; ? = absolute value [ ] ul ll ? = bound /saturation number range from ll to ul , over/under - flow is report ed as saturation in status byte.
zssc3036 datasheet ? 2016 integrated device technology, inc. 43 april 20, 2016 3.8.2. temperature signal compensation temperature is measured internally. temperature correction contains bot h linear gain and offset terms as well as a second - order term to correct for any nonlinearities. for temperature, second - order compens ation for nonlinearity is always parabolic. again, the correction formula is best represented as a two - step process as follows: simplified: ( ) 15 15 2 _ _ 2 _ + + ? = t offset raw t t gain z t ( delimit ed to positive number range) (19) ? ? ? ? ? ? + ? ? = 15 15 15 2 2 _ 2 t t z t sot z t ( delimit ed to positive number range) (20) complete: [ ] 1 2 0 15 1 2 2 1 2 2 15 17 17 17 17 17 2 _ _ 2 _ ? ? ? ? ? ? ? ? ? ? ? ? ? + ? ? ? ? ? ? + ? = t offset raw t t gain z t (21) 1 2 0 1 2 2 15 1 2 2 15 15 16 17 17 17 17 2 2 _ 2 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? + ? ? ? ? ? ? ? ? = t t z t sot z t (22) where gain_t = gain coefficient for temperature; range [ - 1ffff hex to 1ffff hex ]; t_raw = raw temperature reading after az correction; range [ - 1ffff hex to 1ffff hex ]; offset_t = offset coefficient for temperature; range [ - 1ffff hex to 1ffff hex ]; sot_t = second - order term for temperature source non - linearity; range [ - 1ffff hex to 1ffff hex ]
zssc3036 datasheet ? 2016 integrated device technology, inc. 44 april 20, 2016 4 die p ad assignments t he zssc 3036 is available in die form . s ee figure 4 . 1 for pad assignments . note that the zmdi - test pads are for idt use only. figure 4 . 1 zssc 3036 pad assignments table 4 . 1 p ad assignments name direction type description vdd1 in supply ic positive supply voltage for the ic, regular bond pad vdd2 ic positive supply voltage for the ic, special pad (electrically connected to vdd1, also bondable) vss in supply ground reference voltage signal vssb out analog negative bridge supply (bridge sensor ground) vddb out analog positive bridge supply inp in analog positive bridge signal inn in analog negative bridge signal
zssc3036 datasheet ? 2016 integrated device technology, inc. 45 april 20, 2016 name direction type description eoc1 out digital end of conversion, regular bond pad eoc2 end of conversion, special pad (electrically connected to eoc1, also bondable) sel in digital i2c ? or spi interface select sclk/scl in digital clock input for spi /i2c? mosi/sda in/out digital data input for spi; data in/out for i2c ? miso out digital data output for spi ss in digital slave select for spi zmdi - test - - do not connect to these pads 5 quality and reliability the zssc 3036 is available in standard and extended qualifi cation ic version s . for the standard version zssc3036c c xxx , all data specified parameters are guaranteed if not stated otherwise. for the extended qualification version zssc3036c i xxx, there is also specific testing in order to sort for ic - specific (htol - qualified) early failures . 6 ordering sales codes sales code description package zssc3036cc1b die ? temperature range: ? 40c to +85 c wafer (304m) unsawn, tested zssc3036cc6b die ? temperature range: ? 40c to +85 c wafer ( 725 m) unsawn, tested zssc3036ci1b die ? temperature range: ? 40c to +85 c, extended qualification wafer (304m) unsawn, tested zssc3036ci 6 b die ? temperature range: ? 40c to +85 c, extended qualification wafer ( 725 m) unsawn, tested zssc3036cc1c die ? temperature range: ? 40c to +85c dice on frame (304m), tested zssc3036c i 1c die ? temperature range: ? 40c to +85c, extended qualification dice on frame (304m), tested zssc3036ci1bh die ? temperature range: ? 40c to +110 c, 1 extended qualification wafer (304m) unsawn, tested zssc3036ci 6 bh die ? temperature range: ? 40c to +110 c, extended qualification wafer ( 725 m ) unsawn, tested zssc3036ci1ch die ? temperature range: ? 40c to +110 c, extended qualification dice on frame (304m), tested zssc30x6 - kit evaluation kit for zssc30x6 product fami ly, including boards, cable, software, and 1 sample kit contact idt sales for additional information. 7 related documents
zssc3036 datasheet ? 2016 integrated device technology, inc. 46 april 20, 2016 document zssc3036 feature sheet zssc3036 application note: application circuits zssc30x6 evaluation kit documentation zssc30x6 application note: calibration visit the zssc3036 product page www.idt.com/zssc3036 or contact your nearest sales office for the latest version of these documents. 8 glossary term description a2d analog - to - digital ack acknowledge (interface?s protocol indicator for successful data/command transfer) adc analog - to - digital converter or conversion az auto - zero (unspecific) az b auto - zero measurement for sensor bridge path azt auto - zero measurement for temperature path clk clock dac digital -to - analog conversion or converter df data fetch (this is a command type) dsp digital signal processor (digital configuration, calibration, calculation, communication unit) eoc end of conversion fso full scale output (value in percent relative to the adc maximum output code; resolution dependent) htol high temperature operating life lsb least significant bit (?fine? portion of the converted signal) lfsr linear feedback shift register miso master input, slave output (spi) mosi master output, slave in put (spi) mr measurement request (this is a command type) msb m ost significant bit (?coarse? portion of the converted signal) mtp multiple - time programmable nack not acknowledge (interface?s protocol indicator for unsuccessful data/command transfer) otp one time programmable por power - on reset
zssc3036 datasheet ? 2016 integrated device technology, inc. 47 april 20, 2016 term description preamp pre amplifier psrr power supply disturbance rejection scl serial clock line ( i2c?) sclk serial clock (spi) sda serial data line ( i2c?) sm signal measurement sot second - order term spi serial peripheral interface ss slave select (spi) tc temperature coefficient (of a resistor or the equivalent bridge resistance) tm temperature measurement
zssc3036 datasheet ? 2016 integrated device technology, inc. 48 april 20, 2016 9 document revision history revision date description 1.00 j une 12 , 201 2 first release of data sheet. 1.10 january 22, 2013 corrected measurement duration values; new contact information table. 1.20 may 2 8 , 2013 update for contact information and imagery for cover and headers. 2.00 march 1 3 , 2014 reduction of internal oscillator frequency, conver sion rates, and adc clock frequency ; increase in adc - conversion times ; longer start - up and wake -up times. 2.01 august 24, 2014 update for contact information. minor edit s for die information. april 20 , 2016 changed to idt branding. corporate headquarters 6024 silver creek valley road san jose, ca 95138 www.idt.com sales 1- 800- 345- 7015 or 408 - 284- 8200 fax: 408 - 284- 2775 www.idt.com/go/sales tech support www.idt.com/go/support disclaimer integrated device technology, inc. (idt) reserves the right to modify the products and/or specifications described herein at any time, without notice, at idt's sole discretion. performance specifications and operating parameters of the described products are determined in an independent state and are not guarante ed to perform the same way when installed in customer products. the information contained herein is provide d without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of idt's products for any particular purpose, an implied warranty of merchantability, or non - infringement of the intellectual prope rty rights of others. this document is presented only as a guide and does not convey any license under intellectual property rights of idt or any third parties. idt's products are not intended for use in applications involving extreme environmental condit ions or in life support systems or similar devices where the failure or malfunction of an idt product can be reasonably expected to significantly affect the health or safety of users. anyone using an idt product in such a manner does so at their own risk, absent an express, written agreement by idt. integrated device technology, idt and the idt logo are trademarks or registered trademarks of idt and its subsidiaries in the united states and other countries. other trademarks used herein are the property of idt or their respective third party owners. fo r datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary . all contents of this document are copyright of integrated device technology, inc. all rights reserved.

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